The Ultimate High Accuracy Indent and Cleaving System for Semiconductor & Electronics Industries!
Description:
The PELCO® LatticeAx® 420 (formerly from LatticeGear™) provides the Highest level of Accuracy and Performance in the PELCO® LatticeAx® Indent and Cleaving System model lineup. The PELCO® LatticeAx® 420 delivers our highest cleaving accuracy of 10μm in less than 5 minutes making it ideal for any lab that values speed and high accuracy while at the same time needing to accommodate a variety of sample sizes, thicknesses and material types. The patented PELCO® LatticeAx® base is integrated with a complete vision package that includes a monocular microscope with 4μm optical resolution, color CCD camera and real-time image acquisition and display software, and an X-Y stage. This dedicated cleaving workstation is designed so any trained user can easily survey, align, micro-indent, cleave, and inspect processed samples.
Feature:
-
Ultra high accuracy positioning of target (±10µm)
-
Focus mount with coarse and fine focus control
-
Monocular, parfocal, zoom lens (0.58-7x mag) with color CCD camera (computer and monitor not included)
-
Indent position control with 5µm step size
-
Polished tip diamond indenter 5-minute process sample setup to cleave
-
Simple to use, ergonomic design and small footprint
-
Cleaves a wide range of materials and sample sizes
-
Clock dial for indent depth calibration
Applications:
|
|
|
|
|
Diamond Indenter |
Cleaved Semiconductor |
Delidded MEMS Device |
|
|
|
|
|
|
|
|
|
SMB6 Cleaved with the LatticeAx® |
Cleaved Sapphire Wafer |
Cleaved Copper Film on Silicon |
